Infinix has launched its first self-developed power management Cheetah X1 chip, which will be the foundation for the new All-Round FastCharge 2.0 in the upcoming Infinix NOTE 40 Series.
Designed to support the advanced All-Round FastCharge technology found in the NOTE series, the Cheetah X1 combines three modules into one compact chip for efficient charging.
The All-round Support Module accommodates eight charging scenarios, consolidating protocols and adjusting charge across diverse use cases, including up to 100W multi-speed wired charging, wireless charging, wired reverse charging, wireless reverse charging, bypass charging, AI charging protection for night charging, extreme-temp tech for -20°C, and multi-protocol charging.
High-precision Power Monitor Module detects current and voltage in real-time and adjusts charging volume to balance efficiency and temperature control. This protects the battery life and maintains the health of the phone.
Safety Module, on the other hand, integrates 63 protection measures to cover nearly all potential unsafe charging scenarios. These are automatically activated through the chip’s monitoring and recognition ability and relay information to other protocols in the phone, which can then be used to alert the user.
Thanks to the self-developed chip, the All-Round FastCharge 2.0 can deliver optimized charging efficiency management by serving as a central information hub. As current flows through the phone, the Cheetah X1 chip eliminates the need for translation processes, and intelligent algorithms assess which components require power and efficiently distribute it, akin to the technology’s brain. This streamlined process enables the smartphone to offer advanced charging functions.
Infinix dedicated two years to researching global consumer insights for the development of the Cheetah X1 chip. They assembled a specialized team to leverage advanced packaging technology and comprehensive functional integration, resulting in a customized power management chip that stands as the most feature-rich in the market.
By adopting wafer-level packaging technology, Infinix significantly reduced the chip size, making it one of the smallest available. This technology shortens signal transmission paths and minimizes electrical signal delays, improving electrical performance, especially in high-speed data transmission and high-frequency applications. As a result, the chip’s processing efficiency per unit has increased by an impressive 204%.
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